Imveliso emininzi yeTungsten Carbide Semiconductor Packaging Mold Injection intloko kunye neBhakethi
1. Ubunzima obuphezulu
2. I-abrasion ephezulu kunye nokuxhathisa ukubola.
3. Ukumelana noxinzelelo oluphezulu
4. Ukumelana nobushushu obuphezulu
5. Iimveliso ezinezixhobo eziphambili kunye nomsebenzi ogqibeleleyo
1) Ngaphezulu kweminyaka engama-50 yokuvelisa kunye namava olawulo.
2) Ii-advangages zetekhnoloji ezicacileyo
sihlala sigcina isikhundla esiphezulu kubuchule be-R&D e-China, kwaye sineziko lobuchwepheshe bephondo, kunye neziko lohlalutyo kunye novavanyo.
3)Inkqubo engqongqo yokuVelisa
Sinenkqubo yokuvelisa ezinzileyo nethembekileyo, enezixhobo zenkqubo ephucukileyo, iingcali ezinetalente kunye nenkqubo yokuqinisekisa umgangatho ogqibeleleyo.
4) Inkqubo yokuqinisekisa umgangatho ogqibeleleyo.
Sisebenzisa ngokungqongqo i-ISO9001:2015 inkqubo yolawulo lomgangatho, kwaye siphumeza yonke inkqubo yoxanduva lomgangatho wabasebenzi ukuqinisekisa ngenkonzo eqhubekayo nesebenzayo kubathengi.
5) Okokugqibela kodwa uninzi lwazo zonke
Kwimilo entsonkothileyo engekho mgangathweni equka Umngxuma onemisonto, imingxuma engaboniyo, imingxuma enzulu, kunye nezinye iimilo ezingenakuba ngumatshini omnye owenziwe ngumbumba. ,Sinetekhnoloji kunye nendlela yokwenza imilo ngokomzobo ngamnye wabathengi ngaphambi kokuba i-sintered endaweni yomatshini emva kokucoca, Ngale ndlela sinokonga iindleko ezininzi zoomatshini xa kusetyenzwa okungenanto kwiimveliso ezigqityiweyo.